Integrated circuit package-in-package system
US7288835B2 · kind B2 · utility
77Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2006 |
| Grant date | Oct 30, 2007 |
| Priority date | — |
| Expiry date | Mar 17, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package-in-package system is provided forming a first integrated circuit package having a first interface, stacking a second integrated circuit package having a second interface above the first integrated circuit package, fitting the first interface and the second interface, and attaching a third integrated circuit package on the second integrated circuit package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.