Method of fabricating a wire bond pad with Ni/Au metallization
US7294565B2 · kind B2 · utility
8Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2003 |
| Grant date | Nov 13, 2007 |
| Priority date | — |
| Expiry date | Oct 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for sealing an exposed surface of a wire bond pad with a material that is capable of preventing a possible chemical attack during electroless deposition of Ni/Au pad metallurgy is provided. Specifically, the present invention provides a method whereby a TiN/Ti or TiN/Al cap is used as a protective coating covering exposed surfaces of a wire bond pad. The TiN/Ti or TiN/Al cap is not affected by alkaline chemistries used in forming the Ni/Au metallization, yet it provides a sufficient electrical pathway connecting the bond pads to the Ni/Au pad metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.