Semiconductor memory device and defect remedying method thereof
US7345929B2 · kind B2 · utility
Assignees
Inventors
- Kazuhiko Kajigaya
- Kazuyuki Miyazawa
- Manabu Tsunozaki
- Kazuyoshi Oshima
- Takashi Yamazaki
- Yuji Sakai
- Jiro Sawada
- Yasunori Yamaguchi
- Tetsurou Matsumoto
- Shinji Udo
- Hiroshi Yoshioka
- Hirokazu Saito
- Mitsuhiro Takano
- Makoto Morino
- Sinichi Miyatake
- Eiji Miyamoto
- Yasuhiro Kasama
- Akira Endo
- Ryoichi Hori
- Jun Etoh
- Masashi Horiguchi
- Shinichi Ikenaga
- Atsushi Kumata
Key dates
| Filing date | Mar 7, 2007 |
| Grant date | Mar 18, 2008 |
| Priority date | — |
| Expiry date | Mar 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor memory device formed on a semiconductor chip includes first memory arrays, a plurality of second memory arrays, a first voltage generator, and first bonding pads. The semiconductor chip is divided into first, second and third rectangle regions and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The first memory arrays are formed in the first rectangle region. The second memory arrays are formed in the second rectangle region. The voltage generator and first bonding pads are arranged in the third rectangle region. The first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the second memory arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.