Methods for manufacturing compound-material wafers and for recycling used donor substrates
US7405136B2 · kind B2 · utility
15Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2006 |
| Grant date | Jul 29, 2008 |
| Priority date | — |
| Expiry date | Dec 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention provides methods for manufacturing compound-material wafers and methods for recycling donor substrates that results from manufacturing compound-material wafers. The provided methods includes at least one further thermal treatment step configured to at least partially reduce oxygen precipitates and/or nuclei. Reduction of oxygen precipitates and/or nuclei, improves the recycling rate of the donor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.