Substrate processing apparatus
US7428907B2 · kind B2 · utility
1Cited by
22References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2004 |
| Grant date | Sep 30, 2008 |
| Priority date | — |
| Expiry date | May 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.