Determining physical property of substrate
US7444198B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2006 |
| Grant date | Oct 28, 2008 |
| Priority date | — |
| Expiry date | Dec 15, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0625
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.