Slim cell platform plumbing

US7473339B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Allen L. D'Ambra · Burlingame, US
• Arulkumar Shanmugasundram · Sunnyvale, US
• Michael Yang · Fremont, US
• Yevgeniy Rabinovich · Fremont, US
• Dmitry Lubomirsky · Cupertino, US

Key dates

• Filing date: Apr 16, 2004
• Grant date: Jan 6, 2009
• Expiry date: Jan 24, 2027

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/00
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments of the invention generally provide a fluid delivery system for an electrochemical plating platform. The fluid delivery system is configured to supply multiple chemistries to multiple plating cells with minimal bubble formation in the fluid delivery system. The system includes a solution mixing system, a fluid distribution manifold in communication with the solution mixing system, a plurality of fluid conduits in fluid communication with the fluid distribution manifold, and a plurality of fluid tanks, each of the plurality of fluid tanks being in fluid communication with at least one of the plurality of fluid conduits.