Substrate processing apparatus
US7479205B2 · kind B2 · utility
11Cited by
17References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2004 |
| Grant date | Jan 20, 2009 |
| Priority date | — |
| Expiry date | May 10, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B2203/0288
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.