Chamber stability monitoring using an integrated metrology tool
US7482178B2 · kind B2 · utility
7Cited by
10References
6Claims
0Family size
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Key dates
| Filing date | Aug 6, 2003 |
| Grant date | Jan 27, 2009 |
| Priority date | — |
| Expiry date | Jun 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3081
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for monitoring the stability of a substrate processing chamber and for adjusting the process recipe. Thickness and CD measurement data are collected before wafer processing and after wafer processing by an integrated or an in-situ metrology tool to monitor process chamber stability and to adjust the process recipe. The real time chamber stability monitoring enabled by the integrated metrology tool reduces the risk and cost of wafer mis-processing. The real time process recipe adjustment allows tightening of the process recipe. Process development cycle can also be reduced by the method and apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.