Integrated circuit package system
US7501697B2 · kind B2 · utility
10Cited by
13References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2006 |
| Grant date | Mar 10, 2009 |
| Priority date | — |
| Expiry date | Dec 27, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system is provided forming a carrier having a top side and a bottom side, forming an edge terminal pad on the top side and an inner terminal pad on the bottom side, connecting an integrated circuit die to an inner portion of the edge terminal pad, and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.