Lithography lens system and projection exposure system provided with at least one lithography lens system of this type

US7551361B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Hans-Juergen Rostalski · Oberkochen, DE
• Alexander Epple · Aalen, DE
• Aurelian Dodoc · Heidenheim an der Brenz, DE
• Johannes Wangler · Oberkochen, DE
• Karl-Heinz Schuster · Oberkochen, DE
• Joerg Schultz · Aalen, DE
• Franz-Josef Stickel · Aalen, DE
• Wolfgang Singer · Aalen, DE
• Joachim Wietzorrek · Aalen, DE

Key dates

• Filing date: Jul 14, 2004
• Grant date: Jun 23, 2009
• Expiry date: Sep 27, 2024

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70241
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optical imaging system for a microlithography projection exposure system is used for imaging an object field arranged in an object plane of the imaging system into an image field arranged in an image plane of the imaging system. A projection objective or a relay objective to be used in the illumination system can be involved, in particular. The imaging system has a plurality of lenses that are arranged between the object plane and the image plane and in each case have a first lens surface and a second lens surface. At least one of the lenses is a double aspheric lens where the first lens surface and the second lens surface is an aspheric surface. Lenses of good quality that have the action of an asphere with very strong deformation can be produced in the case of double aspheric lenses with an acceptable outlay as regards the surface processing and testing of the lens surfaces.