Polishing apparatus with grooved subpad
US7601050B2 · kind B2 · utility
10Cited by
32References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.