Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
US7602046B2 · kind B2 · utility
2Cited by
11References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2005 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | May 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a recyclable donor wafer that includes a substrate and a formed layer thereon, wherein the formed layer has a thickness sufficient to provide (a) at least two useful layers for detachment therefrom and (b) additional material that can be removed to planarize exposed surfaces of the useful layers prior to detachment from the donor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.