Controls of ambient environment during wafer drying using proximity head
US7614411B2 · kind B2 · utility
2Cited by
58References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2004 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Apr 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.