Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
US7645635B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2004 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Jul 2, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/806
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.