Method of fabricating a bottle trench and a bottle trench capacitor

US7670901B2 · kind B2 · utility

Assignees

• International Business Machines Corporation · US
• Infineon Technologies North America Corp. · US
• Infineon Technologies AG · DE

Inventors

• Oh-Jung Kwon · Hopewell Junction, US
• Kenneth T. Settlemyer, Jr. · Poughquag, US
• Ravikumar Ramachandran · Beacon, US
• Min Soo Kim · Seoul, KR

Key dates

• Filing date: Feb 20, 2008
• Grant date: Mar 2, 2010
• Expiry date: Apr 20, 2028

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D1/047

Abstract

A method of fabricating a bottle trench and a bottle trench capacitor. The method including: providing a substrate; forming a trench in the substrate, the trench having sidewalls and a bottom, the trench having an upper region adjacent to a top surface of the substrate and a lower region adjacent to the bottom of the trench; forming an oxidized layer of the substrate in the bottom region of the trench; and removing the oxidized layer of the substrate from the bottom region of the trench, a cross-sectional area of the lower region of the trench greater than a cross-sectional area of the upper region of the trench.