Method and system for supplying a cleaning gas into a process chamber
US7699935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2008 |
| Grant date | Apr 20, 2010 |
| Priority date | — |
| Expiry date | Jun 19, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/905
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for cleaning a process chamber are provided. In one embodiment, a process chamber is provided that includes a remote plasma source and a process chamber having at least two processing regions. Each processing region includes a substrate support assembly disposed in the processing region, a gas distribution system configured to provide gas into the processing region above the substrate support assembly, and a gas passage configured to provide gas into the processing region below the substrate support assembly. A first gas conduit is configured to flow a cleaning agent from the remote plasma source through the gas distribution assembly in each processing region while a second gas conduit is configured to divert a portion of the cleaning agent from the first gas conduit to the gas passage of each processing region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.