Panel and semiconductor device having a composite plate with semiconductor chips

US7713791B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Thomas Bemmerl · Schwandorf, DE
• Edward Fuergut · Nuremberg, DE
• Simon Jerebic · Regensburg, DE
• Hermann Vilsmeier · Regensburg, DE

Key dates

• Filing date: May 19, 2006
• Grant date: May 11, 2010
• Expiry date: Mar 8, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49014
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a panel and a semiconductor device including a composite plate with semiconductor chips and a plastic packaging compound, and to processes for producing them. For this purpose, the panel having a composite plate has semiconductor chips arranged in rows and columns on a top side of a wiring substrate. The wiring substrate is covered by a plastic packaging compound in a plurality of semiconductor device positions, the rear sides of the semiconductor chips being fixed on the wiring substrate. A plastic packaging compound in the region of the boundary surfaces with the semiconductor chips has a coefficient of thermal expansion which is matched to that of silicon, while the remaining plastic packaging compound has a coefficient of thermal expansion which is matched to that of the wiring substrate and is therefore correspondingly higher.