Apparatus for applying a plating solution for electroless deposition
US7752996B2 · kind B2 · utility
2Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2006 |
| Grant date | Jul 13, 2010 |
| Priority date | — |
| Expiry date | May 29, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electroless plating chamber is provided. The electroless plating chamber includes a chuck configured to support a substrate and a bowl surrounding a base and a sidewall of the chuck. The base has an annular channel defined along an inner diameter of the base. The chamber includes a drain connected to the annular channel. The drain is capable of removing fluid collected from the chuck. A proximity head capable of cleaning and substantially drying the substrate is included in the chamber. A method for performing an electroless plating operation is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.