Apparatus for cleaning edge of substrate and method for using the same
US7758404B1 · kind B1 · utility
3Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2005 |
| Grant date | Jul 20, 2010 |
| Priority date | — |
| Expiry date | Apr 18, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B9/065
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus, system and method for cleaning a substrate edge include a composite applicator that cleans bevel polymers deposited on wafer edges using frictional contact in the presence of fluids. The composite applicator includes a support material and a plurality of abrasive particles distributed within and throughout the support material. The composite applicator cleans the edge of the wafer by allowing frictional contact of the plurality of abrasive particles with the edge of the wafer in the presence of fluids, such as liquid chemicals, to cut, rip and tear the bevel polymer from the edge of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.