Test structure for monitoring leakage currents in a metallization layer

US7764078B2 · kind B2 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Frank Feustel · Dresden, DE
• Thomas Werner · Radebeul, DE
• Carsten Peters · Dresden, DE

Key dates

• Filing date: Jan 16, 2007
• Grant date: Jul 27, 2010
• Expiry date: Jan 16, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

By providing a plurality of resistors and a plurality of test patterns within a leakage current test structure, the number of probe pads required for estimating the plurality of test patterns may be significantly reduced, wherein, in some illustrative embodiments, several test patterns may be simultaneously assessed on the basis of two probe pads. Consequently, process parameters and/or design parameters for manufacturing metallization structures of semiconductor devices may be efficiently monitored and controlled.