Method and system for using a two-phases substrate cleaning compound
US7799141B2 · kind B2 · utility
7Cited by
104References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2006 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Jan 17, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.