IC layout optimization to improve yield
US7818694B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2008 |
| Grant date | Oct 19, 2010 |
| Priority date | — |
| Expiry date | Jan 2, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/39
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Optimizing an integrated circuit design to improve manufacturing yield using manufacturing data and algorithms to identify areas with high probability of failures, i.e. critical areas. The process further changes the layout of the circuit design to reduce critical area thereby reducing the probability of a fault occurring during manufacturing. Methods of identifying critical area include common run, geometry mapping, and Voronoi diagrams. Optimization includes but is not limited to incremental movement and adjustment of shape dimensions until optimization objectives are achieved and critical area is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.