Layer between interfaces of different components in semiconductor devices

US7834467B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Alfred Haimerl · Sinzing, DE
• Khalil Hosseini · Weihmichl, DE
• Angela Kessler · Regensburg, DE
• Joachim Mahler · Regensburg, DE
• Wolfgang Schober · Amberg, DE

Key dates

• Filing date: Mar 28, 2007
• Grant date: Nov 16, 2010
• Expiry date: Aug 7, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/831
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A layer improves adhesion between interfaces of different components in semiconductor devices. The interface of a first component includes surfaces of a circuit carrier and the interface of a second component includes contact surfaces of a plastic package molding compound. The adhesion-improving layer includes a mixture of polymeric chain molecules and carbon nanotubes.