Microlithographic exposure method as well as a projection exposure system for carrying out the method

US7847921B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Toralf Gruner · Hennef (Sieg), DE
• Daniel Kraehmer · Aalen, DE
• Michael Totzeck · Schwäbisch Gmünd, DE
• Johannes Wangler · Oberkochen, DE
• Markus Brotsack · Aalen, DE
• Nils Dieckmann · Wertingen, DE
• Aksel Goehnermeier · Aalen, DE
• Markus Schwab · Aalen, DE
• Damian Fiolka · Oberkochen, DE
• Markus Zenzinger · Ulm, DE

Key dates

• Filing date: Jul 22, 2008
• Grant date: Dec 7, 2010
• Expiry date: Jul 22, 2028

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70308
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In an exposure method for exposing a substrate which is arranged in the area of an image plane of a projection objective as well as in a projection exposure system for performing that method, output radiation directed at the substrate and having an output polarization state is produced. Through variable adjustment of the output polarization state with the aid of at least one polarization manipulation device, the output polarization state can be formed to approach a nominal output polarization state. The polarization manipulation can be performed in a control loop on the basis of polarization-optical measuring data.