Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
US7851913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2006 |
| Grant date | Dec 14, 2010 |
| Priority date | — |
| Expiry date | Apr 24, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.