Temperature measurement and control of wafer support in thermal processing chamber
US7860379B2 · kind B2 · utility
20Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2007 |
| Grant date | Dec 28, 2010 |
| Priority date | — |
| Expiry date | Sep 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.