Multi-chip semiconductor connector and method
US7875964B2 · kind B2 · utility
1Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2007 |
| Grant date | Jan 25, 2011 |
| Priority date | — |
| Expiry date | Sep 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is suitable for attaching to a first semiconductor die and a second conductive strip that is attached suitable for attaching to a second semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.