Patent · US Active

Semiconductor wafer carrier blade

US7878562B2 · kind B2 · utility

11Cited by

12References

21Claims

0Family size

Assignee

MEMC Electronic Materials, Inc. · US

Inventors

Manabu Hamano · Utsunomiya, JP
John A. Pitney · Saint Peters, US
Lance G. Hellwig · Florissant, US

Key dates

Filing date	Dec 31, 2007
Grant date	Feb 1, 2011
Priority date	—
Expiry date	Jun 1, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S414/141
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier blade for transferring a semiconductor wafers into and out of a deposition chamber may include transition surfaces sloping downward from ledge surfaces. The transition surfaces slope from the corresponding ledges at angles that are greater than about 90 degrees so that the edges between the ledge surfaces and the transition surfaces are not sharp. The carrier blade may include bevels extending from the ledge surface(s) to upper lateral edges of the carrier blade.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.