Method and composition for electrochemically polishing a conductive material on a substrate

US7879255B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Huyen Karen Tran · San Jose, US
• Renhe Jia · Naperville, US
• You Wang · Cupertino, US
• Stan Tsai · Clifton Park, US
• Martin S. Wohlert · San Jose, US
• Daxin Mao · Cupertino, US

Key dates

• Filing date: Nov 3, 2006
• Grant date: Feb 1, 2011
• Expiry date: Dec 2, 2029

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23H5/08
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.