Semiconductor power device package having a lead frame-based integrated inductor
US7884452B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2007 |
| Grant date | Feb 8, 2011 |
| Priority date | — |
| Expiry date | Jan 30, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor power device package having a lead frame-based integrated inductor is disclosed. The semiconductor power device package includes a lead frame having a plurality of leads, a inductor core attached to the lead frame such that a plurality of lead ends are exposed through a window formed in the inductor core, a plurality of bonding wires, ones of the plurality of bonding wires coupling each of the plurality of lead ends to adjacent leads about the inductor core to form the inductor, and a power integrated circuit coupled to the inductor. In alternative embodiments, a top lead frame couples each of the plurality of lead ends to adjacent leads about the inductor core by means of a connection chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.