Patent · US Active

Semiconductor device

US7906860B2 · kind B2 · utility

32Cited by

28References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Markus Brunnbauer · Lappersdorf, DE
Marcus Kastner · Ottobrunn, DE
Stephan Bradl · Regensburg, DE

Key dates

Filing date	Oct 26, 2007
Grant date	Mar 15, 2011
Priority date	—
Expiry date	Aug 6, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.