Patent · US Active

Retaining ring with shaped surface

US7927190B2 · kind B2 · utility

7Cited by
20References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 17, 2008
Grant dateApr 19, 2011
Priority date
Expiry dateMar 17, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49815
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.