Patent · US Active

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

US7944061B2 · kind B2 · utility

7Cited by

13References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Thomas Bemmerl · Schwandorf, DE
Edward Fuergut · Nuremberg, DE
Simon Jerebic · Regensburg, DE
Christian Stuempfl · Schmidgaden, DE
Horst Theuss · Wenzenbach, DE
Hermann Vilsmeier · Regensburg, DE

Key dates

Filing date	Sep 20, 2005
Grant date	May 17, 2011
Priority date	—
Expiry date	Mar 28, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.