Apparatus and method for depositing and planarizing thin films of semiconductor wafers

US7947157B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• Mike Ravkin · Sunnyvale, US
• John M. Boyd · Atascadero, US
• Yezdi Dordi · Palo Alto, US
• Fred C. Redeker · Fremont, US
• John M. de Larios · Palo Alto, US

Key dates

• Filing date: Jul 28, 2006
• Grant date: May 24, 2011
• Expiry date: Feb 17, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67051
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.