Patent · US Active

Plasma processing apparatus

US7972469B2 · kind B2 · utility

4Cited by
17References
23Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 22, 2007
Grant dateJul 5, 2011
Priority date
Expiry dateMay 4, 2030

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J37/32623
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

Embodiments of the present invention relate to plasma processing apparatus and methods of use thereof. In some embodiments, a plasma control magnet assembly includes a plurality of magnets arranged in a predetermined pattern that generate a magnetic field having a strength greater than 10 Gauss in a region proximate the assembly and less than 10 Gauss in a region remote from the assembly.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.