Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7993944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jan 23, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Microelectronic imager assemblies with optical devices having integral reference features and methods for assembling such microelectronic imagers is disclosed herein. In one embodiment, the imager assembly can include a workpiece with a substrate having a front side, a back side, and a plurality of imaging dies on and/or in the substrate. The imaging dies include image sensors, integrated circuitry operatively coupled to the image sensors, and external contacts electrically coupled to the integrated circuitry. The assembly also includes optics supports on the workpiece. The optics supports have openings aligned with corresponding image sensors and first interface features at reference locations relative to corresponding image sensors. The assembly further includes optical devices having optics elements and second interface features seated with corresponding first interface features to position the optics elements at a desired location relative to corresponding image sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.