Integrated circuit package-in-package system and method for making thereof
US8049322B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2010 |
| Grant date | Nov 1, 2011 |
| Priority date | — |
| Expiry date | Jun 16, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.