Method of manufacture of an integrated circuit system with self-aligned isolation structures
US8053327B2 · kind B2 · utility
2Cited by
15References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2006 |
| Grant date | Nov 8, 2011 |
| Priority date | — |
| Expiry date | Oct 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit system is provided including providing a substrate, forming an isolation structure base in the substrate without removal of the substrate, and forming a first transistor in the substrate next to the isolation structure base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.