Zhao Lun
21Patents
4h-index
56Co-inventors
62Inventor score
Filing activity: Jul 29, 2003 → Nov 4, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9337306B2 | Multi-phase source/drain/gate spacer-epi formation | Electricity | 26 | Active |
| US9419101B1 | Multi-layer spacer used in finFET | Electricity | 12 | Active |
| US7485524B2 | MOSFETs comprising source/drain regions with slanted upper surfaces, and method for fabricating the same | Electricity | 9 | Active |
| US6998682B2 | Method of forming a partially depleted silicon on insulator (PDSOI) transistor with a pad lock body extension | Electricity | 5 | Expired |
| US7838390B2 | Methods of forming integrated circuit devices having ion-cured electrically insulating layers therein | Electricity | 4 | Active |
| US6905919B2 | Method of forming a partially depleted silicon on insulator (PDSOI) transistor with a pad lock body extension | Electricity | 4 | Expired |
| US8178417B2 | Method of forming shallow trench isolation structures for integrated circuits | Electricity | 4 | Active |
| US8716081B2 | Capacitor top plate over source/drain to form a 1T memory device | Electricity | 4 | Active |
| US8274115B2 | Hybrid orientation substrate with stress layer | Electricity | 3 | Active |
| US9362176B2 | Uniform exposed raised structures for non-planar semiconductor devices | Electricity | 2 | Active |
| US8053327B2 | Method of manufacture of an integrated circuit system with self-aligned isolation structures | Electricity | 2 | Active |
| US9059218B2 | Reducing gate expansion after source and drain implant in gate last process | Electricity | 1 | Active |
| US8987083B1 | Uniform gate height for semiconductor structure with N and P type fins | Electricity | 1 | Active |
| US7326609B2 | Semiconductor device and fabrication method | Electricity | 0 | Expired |
| US7795680B2 | Integrated circuit system employing selective epitaxial growth technology | Electricity | 0 | Active |
| US7259072B2 | Shallow low energy ion implantation into pad oxide for improving threshold voltage stability | Electricity | 0 | Expired |
| US7767577B2 | Nested and isolated transistors with reduced impedance difference | Electricity | 0 | Active |
| US8143651B2 | Nested and isolated transistors with reduced impedance difference | Electricity | 0 | Active |
| US9431528B2 | Lithographic stack excluding SiARC and method of using same | Electricity | 0 | Active |
| US7932178B2 | Integrated circuit having a plurality of MOSFET devices | Electricity | 0 | Active |
| US7999300B2 | Memory cell structure and method for fabrication thereof | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.