Signal delivery in stacked device

US8106520B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Brent Keeth · Boise, US
• Mark Hiatt · Charlotte, US
• Terry R. Lee · Boise, US
• Mark E. Tuttle · Boise, US
• Rahul Advani · Boise, US
• John F. Schreck · Houston, US

Key dates

• Filing date: Sep 11, 2008
• Grant date: Jan 31, 2012
• Expiry date: Jan 4, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/5317
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.