Rapid thermal processing chamber with shower head
US8111978B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2008 |
| Grant date | Feb 7, 2012 |
| Priority date | — |
| Expiry date | Nov 22, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and methods for thermally processing a substrate are provided. A chamber containing a levitating support assembly configured to position the substrate at different distances from a plate during the heating and cooling of a substrate. In one embodiment a plurality of openings on the surface of the plate are configured to evenly distribute gas across a radial surface of the substrate. The distribution of gas may couple radiant energy not reflected back to the substrate during thermal processing with an absorptive region of the plate to begin the cooling of the substrate. The method and apparatus provided within allows for a controllable and effective means for thermally processing a substrate rapidly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.