Wafer electroplating apparatus for reducing edge defects

US8172992B2 · kind B2 · utility

Assignee

• Novellus Systems, Inc. · US

Inventors

• Vinay Prabhakar · Cupertino, US
• Bryan L. Buckalew · Tualatin, US
• Kousik Ganesan · Tualatin, US
• Shantinath Ghongadi · Tigard, US
• Zhian He · Beaverton, US
• Steven T. Mayer · Lake Oswego, US
• Robert Rash · Portland, US
• Jonathan D. Reid · Sherwood, US
• Yuichi Takada
• James R. Zibrida · Portland, US

Key dates

• Filing date: Dec 8, 2009
• Grant date: May 8, 2012
• Expiry date: Aug 31, 2030

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D7/123
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.