Method and apparatus for designing and integrated circuit
US8175737B2 · kind B2 · utility
57Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Jul 19, 2006 |
| Grant date | May 8, 2012 |
| Priority date | — |
| Expiry date | Feb 15, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Method and apparatus for designing an integrated circuit by adding a plurality of control points to an integrated circuit wafer design. Each control point has at least one attribute. Then, an integrated circuit wafer is manufactured using the integrated circuit wafer design. A defect on the integrated circuit wafer is then located. The control points are adjusted such that they correspond with the defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.