Patent · US Active

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

US8183696B2 · kind B2 · utility

38Cited by

0References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Meyer · Regensburg, DE
Rainer Leuschner · Regensburg, DE
Gerald Ofner · Regensburg, DE
Reinhard Hess · Straubing, DE
Recai Sezi · Simmerath, DE

Key dates

Filing date	Mar 31, 2010
Grant date	May 22, 2012
Priority date	—
Expiry date	Aug 27, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3511
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor chip, an encapsulant embedding the semiconductor chip, first contact pads on a first main face of the semiconductor package and second contact pads on a second main face of the semiconductor package opposite to the first main face. The diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, wherein x is the pitch of the second contact pads in micrometers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.