Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beam
US8218284B2 · kind B2 · utility
3Cited by
10References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2008 |
| Grant date | Jul 10, 2012 |
| Priority date | — |
| Expiry date | Jul 3, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/23
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.