Patent · US Active

Three dimensional vertical E-fuse structures and methods of manufacturing the same

US8232190B2 · kind B2 · utility

13Cited by
12References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 1, 2007
Grant dateJul 31, 2012
Priority date
Expiry dateOct 25, 2028

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Three dimensional vertical e-fuse structures and methods of manufacturing the same are provided herein. The method of forming a fuse structure comprises providing a substrate including an insulator layer and forming an opening in the insulator layer. The method further comprises forming a conductive layer along a sidewall of the opening and filling the opening with an insulator material. The vertical e-fuse structure comprises a first contact layer and a second contact layer. The structure further includes a conductive material lined within a via and in electrical contact with the first contact layer and the second contact layer. The conductive material has an increased resistance as a current is applied thereto.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.