Three dimensional vertical E-fuse structures and methods of manufacturing the same
US8232190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2007 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Oct 25, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Three dimensional vertical e-fuse structures and methods of manufacturing the same are provided herein. The method of forming a fuse structure comprises providing a substrate including an insulator layer and forming an opening in the insulator layer. The method further comprises forming a conductive layer along a sidewall of the opening and filling the opening with an insulator material. The vertical e-fuse structure comprises a first contact layer and a second contact layer. The structure further includes a conductive material lined within a via and in electrical contact with the first contact layer and the second contact layer. The conductive material has an increased resistance as a current is applied thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.