Hybrid orientation substrate with stress layer

US8274115B2 · kind B2 · utility

Assignee

• GlobalFoundries Singapore Pte. Ltd. · SG

Inventors

• Lee-Wee Teo · Singapore, SG
• Chung Woh Lai · Singapore, SG
• Johnny Widodo · Singapore, SG
• Shyue Seng Tan · Singapore, SG
• Shailendra Mishra · Fremont, US
• Zhao Lun · Singapore, SG
• Yong Meng Lee · Singapore, SG
• Jeffrey Chee · Mililani, US

Key dates

• Filing date: Mar 19, 2008
• Grant date: Sep 25, 2012
• Expiry date: Sep 1, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D87/00

Abstract

A hybrid orientation substrate includes a base substrate having a first orientation, a first surface layer having a first orientation disposed on the base substrate in a first region, and a second surface layer disposed on the base substrate in a second region. The second surface layer has an upper sub-layer having a second orientation, and a lower sub-layer between the base substrate and the upper sub-layer. The lower sub-layer having a first stress induces a second stress on the upper sub-layer.