Patent · US Active

Electronic component with buffer layer

US8283756B2 · kind B2 · utility

3Cited by

31References

18Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Ivan Galesic · Regensburg, DE
Joachim Mahler · Regensburg, DE
Alexander Heinrich · Bad Abbach, DE
Khalil Hosseini · Weihmichl, DE

Key dates

Filing date	Aug 20, 2007
Grant date	Oct 9, 2012
Priority date	—
Expiry date	Aug 31, 2029

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between the metal substrate and the semiconductor chip configured to mechanically decouple the semiconductor chip and the metal substrate. The buffer layer extends across less than an entire bottom surface of the semiconductor chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.