Analyzing apparatus, program, defect inspection apparatus, defect review apparatus, analysis system, and analysis method
US8290241B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | Oct 16, 2012 |
| Priority date | — |
| Expiry date | Jan 26, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In order to allow to easily specify inspection recipe with which defects desired to be detected can be detected efficiently, a defect inspection apparatus performs defect inspection of a substrate in accordance with a plurality of inspection recipes and produces defect information associated with position of defect in the substrate and attribute data of the defect for each of the inspection recipes and a defect review apparatus produces review result information specifying a kind of defect selected from defects contained in the defect information. An analyzing apparatus obtains defect information and review result information and totalizes the number of defects having attribute data similar to attribute data possessed in defects corresponding to kind of defects to be analyzed for each inspection recipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.